About the Journal :
Experimental and Theoretical NANOTECHNOLOGY (ETN) abbreviated as Exp. Theo. NANOTECHNOLOGY is a multidisciplinary peer-reviewed and open access journal. It includes specialized research papers, short communications, reviews and selected conference papers in special issues on the characterization, synthesis, processing, structure and properties of different principles and applications of nanotechnology with focus on advantageous achievements and applications for the specialists in engineering, chemistry, physics, materials science and medicine. ETN covers and publishes all aspects of fundamental and applied researches of experimental and theoretical nanoscale technology dealing with materials synthesis, processing, nanofabrication, nanoprobes, spectroscopy, properties, biological systems, nanostructures, nanoelectronics, nano-optics, nano-mechanics, nanodevices, nanobiotechnology, nanomedicine, nanotoxicology within the scope of the journal. ETN aims to acquire the recent and outstanding researches for the benefit of the human being.
Single walled carbon nanotubes reinforced intermetallic TiNi matrix nanocomposites by spark plasma sintering
We report the processing of single walled carbon nanotubes (SWCNTs) reinforced TiNi intermetallic matrix nanocomposites from Ti/Ni and SWCNTs powders using spark plasma sintering (SPS) at temperatures from 1000 °C to 1200 °C. The SWCNTs are doped into the TiNi matrix from 0.0 to 1.0 wt%. The effect of SWCNTs reinforcement contents on the relative density, phases, microstructure and microhardness of TiNi intermetallics matrix andCNTs/TiC/TiNi nanocomposites are studied. The experimental results show that the TiNi sintered at T= 1200 °C reinforced with 0.8 wt% SWCNTs has the highest Vicker’s microhardness and relative density, which were HV 5.29 GPa and 96%, respectively . That can be explained by the precipitation of TiC and Ti2Ni in the matrix.This study explores the possibility of developing novel TiNi matrix nanocomposites with shape memory effect and biocompatibility.